Disclosed is a method for a wave solder stiffener fence that uses the through hole solder joint to stiffen the BGA/FCBGA package. Benefits include minimizing board warpage and the risk of solder joint fractures.

Background

Currently, BGA/FCBGA packages are susceptible to corner solder joint fractures associated with board warpage, and board flexing that is introduced during shock and vibration, and the heat sink assembly. This problem is currently addressed by introducing corner sacrificial balls into the process; however, this solution reduces the functional ball count.

General Description

The disclosed method introduces a wave solder stiffener fence design that uses the through hole solder joint to stiffen the BGA/FCBGA package. The disclosed method reduces board warpage, board flexing, and minimizes the risk of solder joint fractures. Figure 1 shows the wave solder stiffener fence design. Figure 2 shows the design’s heat sink mounting base feature. Figure 3 shows an exploded view of the wave solder stiffener assembly.

Advantages

The disclosed method reduces the risk of solder joint fractures without sacrificing the functional ball count.

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Disclosed anonymously