CMP Pressure/Vacuum Quick Disconnect Mechanism (16-Nov-2009)

CMP Pressure/Vacuum Quick Disconnect Mechanism

Background

During wafer processing in a Chemical Mechanical Polish (CMP) Tool a wafer must be held securely in place. Process and handling requires application of vacuum, air pressure and water to the backside of the wafer. OEM implementation utilizes a dual port connection with bulk head fittings. This approach leads to

High failure rate and scrap

^- High Cost of ownership (fitting wear, short life of hose & connectors)

^- Difficult to install on tool (orientation/alignment)

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^- Difficult to maintain

       Description

The disclosed method replaces the dual port vacuum/

p

ressure connection with a single

p

ort quick disconnect mechanis

m

                    . This robust design features a single port welded stainless steel quick disconnect that eliminates 5 components in the connection path. The attached photos show the modification of the existing wafer carrier with the welded quick disconnect. On the wafer carrier this disconnect is connected to stainless steel tubing that eliminates the PFA plastic hoses and bulk head fittings.

Advantages

The disclosed method provides advantages including:

Single Port Connection

^- Welded connections

^- Low maintenance

^- Low cost of ownership

^- Low cost to manufacture and implementation

^- Visual installation method, only 1 option for installation

-

^- Low failure Rate

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