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Telescopic Void Equalizer (18-Jan-2010)

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IP.com Prior Art Database Disclosure (Source: IPCOM)
Disclosure Number IPCOM000191870D dated 18-Jan-2010
Originally published in Prior Art Database
Disclosed by: IBM
Country: Undisclosed
Disclosure File: 2 pages / 72.8 KB / English (United States)

Appliances come in undefined depths and create thermal issues such as recirculation and thermal interference due to the bleeding of heated air into adjacent appliance cold intake space. This is due to introduction of heated exhaust from all appliances contained in close proximity of defined cold intake. This device is designed to occupy the void, to maintain consistent and precise spacing between cold intake and hot exhaust of appliances. It isolates cold intake from heated exhaust.

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Telescopic Void Equalizer

The Void equalizer occupies space between a rack's front or rear EIA (Electronic Industry Alliance) standard rail not consumed within specific U space by an appliance and specifically channels cold air to the appliance, creating in effect an extension to the appliance. This establishes a defined, sealed cold aisle intake and a hot aisle exhaust for the specific appliance by telescoping the void equalizer out until to mate with the appliance.

The void equalizer mounts to the rack's front cold aisle EIA rails or rear hot aisle EIA rails and occupies space between these rails sealing up to the appliance. It is adjustable in depth and can be designed for a specific desired U height depending upon the appliance and application. The figure illustrates one specific example of this telescoping void equalizer and this concept could be utilized in other applications requiring air or fluid sealed transfers.

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(Source: IPCOM)
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(Source: IPCOM)