Silicon microphone with integrated MID traces for connection to PCB

IP.com Prior Art Database Disclosure
IP.com Disclosure Number: IPCOM000195011D
Publication Date: 10-May-2010
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Publishing Venue

The IP.com Journal (v10n5A)

Related People

Juergen Carstens - Contact
juergen.carstens@siemens.com; phone +49-89-636-82995

Abstract

In hearings aids silicon microphones can be used. Up to now, the Printed Circuit Board (PCB) assembly for silicon microphones is designed in a way that the solder pads are placed in front of the PCB and next to the spout. This requires an increased litz wire length and more space in the housing, because the wires have to be packed away properly. The litz wires are then soldered to the microphone according to the state of the art. However, it is proposed to build out the air volume of the silicon microphone with plastic material.

Copyright

SIEMENS AG 2010

Language

English (United States)

Country

Singapore

Document File

1 pages / 64.6 KB

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Silicon microphone with integrated MID traces for connection to PCB

Idea: Markus Heerlein, SG-Singapore; Harald Klemenz, SG-Singapore

In hearings aids silicon microphones can be used. Up to now, the Printed Circuit Board (PCB) assembly for silicon microphones is designed in a way that the solder pads are placed in front of the PCB and next to the spout. This requires an increased litz wire length and more space in the housing, because the wires have to be packed away properly. The litz wires are then soldered to the microphone according to the state of the art. However, it is proposed to build out the air volume of the silicon microphone with plastic material. The Molded Interconnect Device (MID) traces can then be laid down and the solder pads can be placed on the back of the PCB. The contact between the solder pads and the PCB can be realized through a flexible PCB. Furthermore, it is proposed to mold one plastic part with two cavities. The cavities are used as a back volume for the silicone microphone. The MID traces can then be laid in any way so that the best connection area to the PCB can be established.

One advantage of the proposed solution is that PCB fits easier to the MID traces in the plastic housing of the microphone. Furthermore, shorter litz wires can be used. This improves the electroacoustics as well as the used space in front of the BTE is minimized.

© SIEMENS AG 2010 file: 2009J09450.doc page: 1

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